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What is a ceramic substrate
Ceramic substrate refers to a special process board in which copper foil is directly bonded to the surface (single or double-sided) of aluminum oxide (Al2O3) or aluminum nitride (AlN) ceramic substrate at high temperature. The ultra-thin composite substrate produced has excellent electrical insulation properties, high thermal conductivity, excellent solderability and high adhesion strength, and can be etched with various patterns like a PCB board and has a large current carrying capacity Therefore, ceramic substrates have become the basic material for high-power power electronic circuit structure technology and interconnection technology.
In the electronic chip packaging process, ceramic substrates mainly play the role of mechanical support, protection and electrical interconnection (insulation). As chip technology continues to develop toward miniaturization, high density, multi-function, and high reliability, the power density of electronic chips is getting larger and larger, and heat dissipation problems are becoming more and more serious. There are many factors that affect device heat dissipation, among which the selection of DPC ceramic substrate material is also a key link.
What's the type of ceramic substrates?
Al2O3, BeO, AlN
At present, alumina has the most obvious advantages. It has stable chemical properties, abundant sources of raw materials, and low technical manufacturing difficulty.
The thermal conductivity of BeO will decrease rapidly after the temperature exceeds 300°, and its toxicity also limits its development.
Although AlN has high thermal conductivity and expansion coefficient, the oxide layer on its surface will affect its thermal conductivity, so its technology needs to be improved.
Alumina ceramic sheets are special corundum ceramics made of AL2O3 as the main raw material, rare metal oxides as flux, and roasted at a high temperature of 1,700 degrees.
Al2O3 ceramics: High alumina content, relatively dense structure, and special properties, so they are called special ceramics. Al2O3 Ceramic materials have a close-packed hexagonal structure composed of oxygen ions, and aluminum ions fill two-thirds of the octahedral gaps. This is the same stable α-Al2O3 structure as natural corundum. Therefore, ceramics have a high melting point and high Hardness, excellent wear resistance.
The hardness of the ceramic patch is ≥HRA85, which is second only to the hardness of diamond. The surface is smooth and the friction coefficient is small, and the wear resistance is very ideal. Especially in high-temperature oxidizing media or corrosive media, the performance of ceramic patch materials is better than that of other metal materials. Far superior.
Ceramic substrates can be divided into high-temperature co-fired multi-layer ceramic substrates, low-temperature co-fired ceramic substrates, and thick-film ceramic substrates according to structure and manufacturing process.
High-temperature co-fired ceramics (HTCC): The production cost of high-temperature co-fired ceramic substrates is relatively high, and its thermal conductivity is generally 20~200W/(m·℃), depending on the composition and purity of the ceramic powder.
Low-temperature co-fired ceramics (LTCC): Low-temperature co-fired ceramic substrates are mixed with alumina powder with a mass fraction of 30% to 30% low-melting point glass material. Gold and silver with good conductivity can be used as electrodes and wiring materials.
Thick film ceramic substrate (DBC): Thick film ceramic substrate is mainly used in electronic packaging that does not require high pattern accuracy.
What are the advantages of ceramic packaging?
1. Good moisture resistance and not prone to micro-cracks;
2. No damage will occur after thermal shock test and temperature cycle test, and the mechanical strength is high;
3. Small thermal expansion coefficient and high thermal conductivity;
4. Good insulation and air tightness, the chip and circuit are not affected by the surrounding environment, and more importantly, its air tightness meets the high requirements of high sealing;
5.It has good light protection, can effectively block visible light and excellently reflect infrared rays, and can also meet the low-reflection requirements of optical-related products.
What's the application of ceramic substrates?
As an important material, ceramic substrates are widely used in electronics, optoelectronics, energy and other fields. Its excellent performance and stability make it an ideal choice for various electronic devices and optoelectronic devices.
Power electronics field
In the manufacturing of electronic components, ceramic substrates are an important material for circuit boards, used to carry and connect electronic components. It has good insulation properties, high thermal conductivity and low temperature expansion coefficient, and can provide good mechanical support and electrothermal performance to ensure the reliable operation of electronic components.
In integrated circuit manufacturing, ceramic substrates can be used as IC packaging materials to provide good electrical insulation properties and thermal conductivity to protect the stable operation of integrated circuits. In addition, ceramic substrates are also widely used in the manufacture of electronic ceramic capacitors, inductors, sensors and other devices to provide stable performance and reliability.
Optoelectronics field
In optical fiber communications, ceramic substrates can be used as the base of optical fiber connectors to fix and protect optical fibers, and provide good mechanical support and thermal conductivity to ensure the transmission quality of optical fibers.
In the manufacturing of optoelectronic devices, ceramic substrates are often used to manufacture packaging and support structures for optoelectronic devices, such as photodiodes, photoelectric sensors, etc., to provide good mechanical stability and electrothermal performance.
In solar cell manufacturing, ceramic substrates are also widely used in cell support and packaging to provide stable mechanical and electrical properties.
New energy field
In fuel cell manufacturing, ceramic substrates can be used as support and conductive materials for batteries. They have good high temperature resistance and conductivity, ensuring the stable operation of fuel cells.
In the manufacturing of energy storage devices, ceramic substrates are often used to manufacture the packaging and support structures of supercapacitors, potassium-ion batteries and other devices to provide good mechanical stability and electrical conductivity.
Ceramic substrates are also widely used in the manufacturing of key components such as battery management systems and power converters for electric vehicles to provide stable mechanical and electrothermal properties.
With the development of science and technology and the increase in application demand, it is believed that ceramic substrates will have broader application prospects in the future.
Ceramic substrate refers to a special process board in which copper foil is directly bonded to the surface (single or double-sided) of aluminum oxide (Al2O3) or aluminum nitride (AlN) ceramic substrate at high temperature.
Al2O3、BeO、AlN
Ceramic substrates can be divided into high-temperature co-fired multi-layer ceramic substrates, low-temperature co-fired ceramic substrates, and thick-film ceramic substrates according to structure and manufacturing process.
Power electronics field
Optoelectronics field
New energy field
