IC packaging substrate manufacturers play a crucial role in the semiconductor industry by producing the substrates that form the foundation for integrated circuits (ICs). The packaging substrate is a critical component that connects the IC to the larger electronic system, providing electrical and mechanical support. This article provides an list of Top 10 global IC packaging substrate manufacturers.
Integrated Circuit (IC) Packaging Substrates
1. Definition:
IC packaging substrates are specialized materials, often made of ceramics or organic materials, that house and connect integrated circuits. They provide a platform for the placement of semiconductor devices and facilitate the transmission of electrical signals between the IC and the larger electronic system.
2. Significance:
IC packaging substrates serve several essential functions, including:
Electrical interconnection: Providing a network of pathways for signals to travel between the IC and other components.
Thermal management: Dissipating heat generated by the IC during operation.
Mechanical support: Protecting the IC from physical damage and ensuring stability within the electronic system.
Top 10 global IC packaging substrate manufacturers
| Headquarters | Taiwan,China |
| Established time | 1990 |
| Company website | https://www.unimicron.com/en/index.html |
Unimicron Technology Corporation is a printed circuit board manufacturer headquartered in Taiwan. The company produces PCBs, high density interconnection boards, flexible PCBs, rigid flex PCBs, integrated circuit carriers, and others. In addition, it provides testing and burn-in services of IC substrates and PCBs.
Unimicron is the world’s third-largest general substrate manufacturer, and the world’s top manufacturer of HDI substrates and has long been the leader in communications-oriented substrate fabrication.
Products
PCB
IC Carrier
Connector
TP & ECRM
Nan Ya PCB
| Headquarters | Taiwan,China |
| Established time | 1997 |
| Company website | https://www.nanyapcb.com.tw/nypcb/english/index.aspx |
Nan Ya PCB Corporation used to be one of the business divisions of Nan Ya Plastics Corporation which is part of Formosa Plastics Group and turned into a subsidiary by 1997 as the manufacturer of Printed Circuit Boards (PCBs) and IC Substrates. Nan YA PCB is the leader in advanced IC substrate and PCB technology.
The businesses of the company include manufacturing and sales of conventional PCB, high density interconnection (HDI), rigid-flex, ABF (Ajinomoto Build-up Film) substrate, and PP (Prepreg) substrate.
IBIDEN
| Headquarters | Gifu, Japan |
| Established time | 1912 |
| Company website | https://www.ibiden.com/ |
Ibiden leads the world in electronics field with the world’s most fine Package Substrate technology. Ibiden was founded as an electrical power generation company in 1912. Ibiden (Ibiden Kabushiki-kaisha) is a Japanese electronics company headquartered in Ogaki, Gifu prefecture that manufactures electronics-related products, such as printed circuit boards and IC packaging.
Products
Electronics
Ceramics
IC Package
SiC-DPF
Substrate Holding Mat
Graphite Specialty
High Temperature Insulation Wool
| Headquarters | Korea |
| Established time | 1973 |
| Company website | https://www.samsungsem.com/global/index.do |
Samsung Electro-Mechanics is a versatile manufacturer of various parts from mechanical parts to high-tech electronic parts. Founded in 1973, Samsung Electro-Mechanics has grown into a world-class company that develops and produces major electronic components.
In our early days, the company established the foundation for the self-reliant component industry in Korea through audio and video component production. In the 1980s, they expanded into materials and computer components, and their focus moved on to developing promising next-generation products, such as components for computer chips, mobile communication devices, and optical devices in the 1990s. Since the 2000s, they have been producing MLCC (Multilayer Ceramic Capacitors), power inductors, camera and communication modules, and substrates with world-class core technologies in materials, high-frequency wireless communication, and precision mechanics.
Products
Passive Component
MLCC
Inductor
Chip Resistor
Tantalum
Module
Camera Module
Package Substrate
SHINKO
| Headquarters | Nagano, Japan |
| Established time | 1946 |
| Company website | https://www.shinko.co.jp/english/ |
SHINKO ELECTRIC INDUSTRIES designs, manufactures, and markets advanced electronic materials, such as semiconductor packages, including leadframes, and PLP(Plastics Laminated Packages).
SHINKO is an integrated manufacturer of semiconductor packages. They develop and produce of various “Semiconductor Packages” adapting for the miniaturization, acceleration, and performance enhancement of semiconductors.
Products
Semiconductor Package
Thermal Management Parts
Product for Semiconductor Manufacturing Equipment
Metal Products
Kinsus
| Headquarters | Taiwan,China |
| Established time | 2000 |
| Company website | https://www.kinsus.com.tw/en-global/Home/Index |
Kinsus Interconnect Technology Corp is a Taiwan-based company principally engaged in the manufacture and distribution of substrates and printed circuit boards (PCBs). Kinsus is now the leading IC substrate maker after establishing technology and experience for many years. Kinsus invested and developed key technologies like finer feature pitch, thinner thickness, and sophisticated structure created technology strength.
Products
SIP
PBGA
FCCSP
CSP
RF module
FCBGA
| Headquarters | Korea |
| Established time | 1970 |
| Company website | https://www.lginnotek.com/main/main.do |
LG Innotek, Korea’s first electronic components company founded in 1970, has grown into a leading global materials and components company. They supply global customers with key materials and components in the fields of mobile, display, semiconductor, automobile, and IoT that are developed and produced in our business sites at home and abroad.
LG Innotek is producing package substrates for smartphones/IT/Server semiconductors and tape substrates, photomasks, and OLED masks for high-resolution displays. They are leading the innovation of the future global substrate market by promoting new FC-BGA business.
Products
Optics Solution
Substrate & Material
Automotive Components
Electronic Components
AT&S
| Headquarters | Austria |
| Established time | 1987 |
| Company website | https://ats.net/en/company/ |
AT&S also known as AT & S Austria Technologie & Systemtechnik Aktiengesellschaft designs and manufactures high-end printed circuit boards and substrates for semiconductors.[citation needed] The company is listed on the Vienna Stock Exchange.
IC substrates
Substrate-like printed circuit boards and modules
Flexible and rigid-flex printed circuit boards
Thermally enhanced printed circuit boards
Cavity printed circuit boards
HDI printed circuit boards
ECP® printed circuit boards
High-frequency & high-speed printed circuit boards
Multilayer printed circuit boards
Test & reference boards
Double-sided printed circuit boards
Daeduck electronics
| Headquarters | South Korea |
| Established time | 1972 |
| Company website | https://www.daeduck.com/eng/ |
DAEDUCK is the First company in Korea that have manufactured printed circuit board. Daeduck is specialized for printed circuit board for semiconductor such as CSP,fcCSP,BOC. DAEDUCK has the best technology for producing ultra-thin package substrate including coreless and automation.
Daeduck Electronics established a quality management system through ISO 9001, and received the IATF 16945 and SQ certification for the electric business, and the AEO certification to secure logistical competitiveness, and acquired certification for environmentally-friendly products from major clients.
Products
PKG
FCBGA
FCCSP
CSP
SIP, AIP
FCBOC
MLB
Wired Network
Optical Module
| Headquarters | Korea |
| Established time | 1987 |
| Company website | https://eng.simmtech.com/ |
SIMMTECH has been concentrating on developing and manufacturing High-layer PCBs for semiconductors since it was established in 1987. Through the accumulated world best manufacturing competitiveness, SIMMTECH is producing most advanced PCBs to semiconductor global leaders. SIMMTECH’s major products are module PCBs for semiconductors’ memory expansion, and substrates for semiconductor chip assembly.
Products
Module PCBs for semiconductors’ memory expansion
Substrates for semiconductor chip assembly
