BGA (Ball Grid Array) chips are a surface mount technology that uses a special array of solder balls to connect to the board instead of traditional pins. The BGA soldering process requires fine operation and specialized equipment, the following are detailed soldering steps.
Chip designers face the daunting task of delivering ever-increasing functionality while shrinking size while managing production and eventual cost. Artificial intelligence, which is good at analyzing and balancing multiple complex factors, is an ideal solution. Here are 5 ways manufacturers can use AI to optimize chip designs.
In the PCB manufacturing process, the stencil is made to accurately coat the solder paste on the solder paste layer of the PCB board. In order to make a stencil layer, the layer used is usually a solder paste layer, or called: “paste mask layer”
In this article, the definition, function, application, design and manufacture of multilayer PCB will be introduced.
Multilayer PCB, one of the PCB types, can be easily found in various electronic devices. Multilayer PCB (Printed Circuit Board) is an electronic component with multiple conductive layers, which is widely used in various electronic devices. In this article, we will learn deeply about multilayer PCB’s strength, its applications in electronics, and its manufacturing difficulties and solution.
FC-CSP is one of the Chip Scale Package (CSP) types. According to the definition of the J-STD-012 standard, CSP refers to a packaging form in which the size of the package does not exceed 1.2 times that of the bare chip. It realizes the electrical interconnection between the chip and the substrate through flip-chip welding of the bump and the substrate, the chip faces downward, and the chip welding area and the substrate welding area are directly interconnected. Compared with WB and TAB bonding methods, the distance between the semiconductor chip and the substrate in FC-CSP is smaller, the signal loss is reduced, and the I/O density is high, which is more suitable for Large-scale Integration (LSI), Very Large Scale Integration(VLSI) and Application Specific Integrated Circuit (ASIC) chips.
PCB layout is one of the important aspects of electronic product design and has a crucial impact on product performance and reliability. When making PCB layout, following the 3W principle can help designers better understand the requirements of the layout, so as to design a better circuit board. This article will detail the specific content of the 3W principle and explore its application in board design.
With the continuous advancement of electronic technology, the application field of high-speed PCB and low-speed PCB continues to expand. In terms of PCB manufacturing and PCB design, these two different printed circuit boards require different manufacturing processes and design techniques. Next, we will introduce in detail the defining criteria for high-speed and low-speed PCBs.
China: Tangtou No.1 Industry Estate, Shiyan Town, Bao'an District, Shenzhen, China,518108
Vietnam: CN-34, Thuan Thanh 2 Industrial Park, An Binh Ward and Mao Dien Ward, Thuan Thanh District, Bac Ninh Town, Vietnam
United States: Fremont, CA, 94538
