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Surface Mount Technology (SMT)

Surface Mount Technology (SMT) – the complete guide

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In today’s fast-paced world, where precision, reliability, and miniaturization are paramount, one groundbreaking technique stands out: Surface Mount Technology (SMT). This innovative method has transformed the electronics manufacturing industry over the past few decades, offering a way to achieve compact designs without compromising performance. In this article, we will delve into the world of SMT, exploring its definition, widespread adoption, advantages and disadvantages, and the intricacies of its assembly process.

FC-CSP (Flip Chip-Chip Scale Package) – A Comprehensive Guide for Beginners FC-CSP

FC-CSP (flip-chip chip scale package) – a comprehensive guide for beginners

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FC-CSP is one of the Chip Scale Package (CSP) types. According to the definition of the J-STD-012 standard, CSP refers to a packaging form in which the size of the package does not exceed 1.2 times that of the bare chip. It realizes the electrical interconnection between the chip and the substrate through flip-chip welding of the bump and the substrate, the chip faces downward, and the chip welding area and the substrate welding area are directly interconnected. Compared with WB and TAB bonding methods, the distance between the semiconductor chip and the substrate in FC-CSP is smaller, the signal loss is reduced, and the I/O density is high, which is more suitable for Large-scale Integration (LSI), Very Large Scale Integration(VLSI) and Application Specific Integrated Circuit (ASIC) chips.

How understand the “3W” rule when PCB layout

How understand the “3W” rule when PCB layout?

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PCB layout is one of the important aspects of electronic product design and has a crucial impact on product performance and reliability. When making PCB layout, following the 3W principle can help designers better understand the requirements of the layout, so as to design a better circuit board. This article will detail the specific content of the 3W principle and explore its application in board design.

On the role of electrolytic capacitor in PCB design

On the role of electrolytic capacitor in PCB design

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Electrolytic capacitor is a kind of capacitor, its positive electrode (aluminum or tantalum) is a metal foil, and the oxide film close to the metal with the positive electrode is a dielectric; Its negative electrode is composed of conductive materials, electrolytes and other materials, because the electrolyte is the main part of the negative electrode, the electrolytic capacitor is named.

How are high-speed PCB and low-speed PCB defined

How are high-speed PCB and low-speed PCB defined?

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With the continuous advancement of electronic technology, the application field of high-speed PCB and low-speed PCB continues to expand. In terms of PCB manufacturing and PCB design, these two different printed circuit boards require different manufacturing processes and design techniques. Next, we will introduce in detail the defining criteria for high-speed and low-speed PCBs.

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