PCB impedance refers to the resistance of an electric circuit on a printed circuit board (PCB) to alternating current. Impedance is a critical parameter that affects signal quality and integrity in high-speed digital circuits.
Blind and buried vias PCB is a widely used in electronic equipment and it combines the structure of multilayer PCB board and blind or buried hole technology, can achieve more complex circuit connection. This article will introduce in detail the definition and function of Blind and buried vias PCBs and explore their differences from traditional PCB boards.
In the ever-evolving world of electronics, Surface Mount Technology (SMT) components have emerged as a driving force behind the miniaturization, efficiency, and performance of electronic devices. In this article, we delve into the world of SMT components, exploring their advantages, types, assembly process, industry applications, and prospects. Join us on this enlightening journey as we uncover the secrets behind the remarkable success of SMT technology.
In today’s fast-paced world, where precision, reliability, and miniaturization are paramount, one groundbreaking technique stands out: Surface Mount Technology (SMT). This innovative method has transformed the electronics manufacturing industry over the past few decades, offering a way to achieve compact designs without compromising performance. In this article, we will delve into the world of SMT, exploring its definition, widespread adoption, advantages and disadvantages, and the intricacies of its assembly process.
The outbreak of new energy vehicles has accelerated, and power components have ushered in new opportunities for growth.
FC-CSP is one of the Chip Scale Package (CSP) types. According to the definition of the J-STD-012 standard, CSP refers to a packaging form in which the size of the package does not exceed 1.2 times that of the bare chip. It realizes the electrical interconnection between the chip and the substrate through flip-chip welding of the bump and the substrate, the chip faces downward, and the chip welding area and the substrate welding area are directly interconnected. Compared with WB and TAB bonding methods, the distance between the semiconductor chip and the substrate in FC-CSP is smaller, the signal loss is reduced, and the I/O density is high, which is more suitable for Large-scale Integration (LSI), Very Large Scale Integration(VLSI) and Application Specific Integrated Circuit (ASIC) chips.
PCB layout is one of the important aspects of electronic product design and has a crucial impact on product performance and reliability. When making PCB layout, following the 3W principle can help designers better understand the requirements of the layout, so as to design a better circuit board. This article will detail the specific content of the 3W principle and explore its application in board design.
Electrolytic capacitor is a kind of capacitor, its positive electrode (aluminum or tantalum) is a metal foil, and the oxide film close to the metal with the positive electrode is a dielectric; Its negative electrode is composed of conductive materials, electrolytes and other materials, because the electrolyte is the main part of the negative electrode, the electrolytic capacitor is named.
PCB ceramic substrate and FR4 substrate are currently more commonly used boards, FR4 substrate is widely used, low cost, PCB ceramic substrate application is relatively high-end, high cost. Today’s article will explain the difference between ceramic PCB and FR4 PCB from the aspects of definition, classification and application energy.
With the continuous advancement of electronic technology, the application field of high-speed PCB and low-speed PCB continues to expand. In terms of PCB manufacturing and PCB design, these two different printed circuit boards require different manufacturing processes and design techniques. Next, we will introduce in detail the defining criteria for high-speed and low-speed PCBs.
China: Tangtou No.1 Industry Estate, Shiyan Town, Bao'an District, Shenzhen, China,518108
Vietnam: CN-34, Thuan Thanh 2 Industrial Park, An Binh Ward and Mao Dien Ward, Thuan Thanh District, Bac Ninh Town, Vietnam
United States: Fremont, CA, 94538
